🇮🇳 GATE Metallurgical Engineering · flashcards

GATE Metallurgical Engineering Physical Metallurgy Flashcards

56 question-and-answer cards covering Physical Metallurgy as it is examined in GATE Metallurgical Engineering. 24 of them are printed below, taken from across the deck — no signup, no paywall on the preview.

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24 sample cards from the Physical Metallurgy deck

Sampled from the end of the deck, so these are different cards from the ones shown on the syllabus page.

  1. Compare secondary electrons (SE) and backscattered electrons (BSE) as SEM imaging signals.

    Secondary electrons are low-energy ($<50\ \mathrm{eV}$) electrons ejected from near the surface, giving high-resolution topographic contrast. Backscattered electrons are high-energy beam electrons elastically scattered back; their yield increases with atomic number $Z$, giving compositional (atomic-number) contrast.

  2. Why does the SEM offer much greater depth of field and resolution than the optical microscope?

    Electrons have a far shorter effective wavelength than visible light (giving higher resolution, $\sim$ few nm), and the small beam-convergence angle gives a large depth of field, so rough surfaces appear sharply in focus over a wide height range.

  3. What is a point defect? Name the three main types in a crystal.

    A point defect is a zero-dimensional disruption of the lattice at a single atomic site. The main types are vacancies (missing atoms), self-interstitials (extra atoms in interstitial sites), and substitutional/interstitial impurity atoms.

  4. Write the equilibrium concentration of vacancies as a function of temperature.

    $$\frac{n_v}{N} = \exp\left(-\frac{Q_v}{k_B T}\right)$$ where $n_v/N$ is the vacancy fraction, $Q_v$ the energy of vacancy formation, $k_B$ Boltzmann's constant, and $T$ the absolute temperature.

  5. Distinguish Schottky and Frenkel defects in ionic crystals.

    A Schottky defect is a paired cation–anion vacancy that preserves charge neutrality. A Frenkel defect is an ion displaced from its lattice site into an interstitial position, creating a vacancy–interstitial pair (usually the smaller cation).

  6. What is a line defect (dislocation), and what are its two pure types?

    A line defect, or dislocation, is a one-dimensional defect around which atoms are misaligned. The two pure types are the edge dislocation (an extra half-plane of atoms) and the screw dislocation (a helical lattice distortion).

  7. Define the Burgers vector and state its orientation relative to the dislocation line for edge and screw dislocations.

    The Burgers vector $\vec{b}$ measures the magnitude and direction of lattice distortion (slip) caused by a dislocation. It is perpendicular ($\perp$) to the line for an edge dislocation and parallel ($\parallel$) to the line for a screw dislocation.

  8. How does dislocation motion (slip) relate to plastic deformation, and why does it lower the required stress?

    Plastic deformation occurs by dislocations gliding on slip planes; only one row of bonds breaks and reforms at a time as the dislocation moves, so the theoretical shear strength is reduced by orders of magnitude compared with rigidly shearing the whole plane at once.

  9. Define dislocation density and give its typical range for annealed vs heavily cold-worked metals.

    Dislocation density is the total dislocation line length per unit volume (units $\mathrm{m/m^{3}} = \mathrm{m^{-2}}$). It is $\sim 10^{10}\ \mathrm{m^{-2}}$ in annealed metals and rises to $\sim 10^{15}$–$10^{16}\ \mathrm{m^{-2}}$ after heavy cold work.

  10. What are surface (interfacial) defects? List the principal types.

    Surface defects are two-dimensional boundaries separating regions of different crystallographic orientation or structure. Principal types: external (free) surfaces, grain boundaries, twin boundaries, stacking faults, and phase boundaries.

  11. Distinguish low-angle from high-angle grain boundaries.

    A low-angle (sub-) grain boundary has a misorientation $\lesssim 10$–$15^{\circ}$ and can be described as an array of dislocations (e.g. a tilt boundary of edge dislocations), with low boundary energy. A high-angle boundary has greater misorientation, a more disordered structure, and higher energy.

  12. What is a twin boundary and how does a twin relate to the parent crystal?

    A twin boundary is a special surface defect across which the lattice is a mirror image of the parent orientation. Twins form by annealing (annealing twins) or by shear (mechanical/deformation twins), and the boundary has very low energy when coherent.

  13. Define a stacking fault and give an example in an FCC crystal.

    A stacking fault is a localized error in the regular stacking sequence of close-packed planes. In FCC the ideal sequence is $\ldots ABCABC\ldots$; a fault such as $\ldots ABC\,AB\,ABC\ldots$ introduces a thin region of HCP-like stacking and is bounded by partial dislocations.

  14. What is a coherent interface, and how does its energy compare with other interfaces?

    A coherent interface is one where the two crystals' lattice planes are continuous across the boundary with one-to-one matching of atoms (perfect registry). It has the lowest interfacial energy ($\sim 1$–$200\ \mathrm{mJ/m^{2}}$) but may carry coherency strain energy if lattice parameters differ slightly.

  15. What is coherency strain, and what happens to a coherent precipitate as it grows?

    Coherency strain is the elastic strain stored when matched lattices have slightly different spacings, forcing them to distort to stay continuous. As a coherent precipitate grows, the total strain energy rises until it becomes energetically favorable to introduce misfit dislocations, transforming it to a semi-coherent interface.

  16. Describe a semi-coherent interface and how the lattice misfit is accommodated.

    A semi-coherent interface has partial atomic matching: regions of coherency are periodically interrupted by misfit (edge) dislocations that absorb the lattice mismatch. Its energy is intermediate between coherent and incoherent interfaces.

  17. Define the lattice misfit $\delta$ and give the approximate spacing of misfit dislocations in a semi-coherent interface.

    The misfit is $\delta = \dfrac{d_\beta - d_\alpha}{d_\alpha}$, where $d_\alpha$ and $d_\beta$ are the unstressed interplanar spacings of the two phases. Misfit dislocations are spaced approximately $D \approx \dfrac{b}{\delta}$ apart, where $b$ is the Burgers vector magnitude.

  18. What is an incoherent interface and why does it have the highest interfacial energy?

    An incoherent interface forms when the two adjoining crystals have very different structures or orientations so there is essentially no atomic matching across the boundary. The disordered, broken-bond structure gives the highest interfacial energy ($\sim 500$–$1000\ \mathrm{mJ/m^{2}}$), similar to a high-angle grain boundary.

  19. State Fick's first law of diffusion and define its terms.

    $$J = -D \frac{\partial C}{\partial x}$$ where $J$ is the diffusion flux (atoms per unit area per unit time), $D$ the diffusion coefficient, and $\dfrac{\partial C}{\partial x}$ the concentration gradient. The minus sign shows flux is down the gradient (steady-state diffusion).

  20. State Fick's second law of diffusion (the diffusion equation) for non-steady-state diffusion.

    $$\frac{\partial C}{\partial t} = D \frac{\partial^{2} C}{\partial x^{2}}$$ (for constant $D$), describing how concentration $C$ at position $x$ changes with time $t$ during non-steady-state diffusion.

  21. Write the temperature dependence of the diffusion coefficient (Arrhenius relation) and define the terms.

    $$D = D_0 \exp\left(-\frac{Q_d}{R T}\right)$$ where $D_0$ is the pre-exponential (frequency) factor, $Q_d$ the activation energy for diffusion, $R$ the gas constant, and $T$ the absolute temperature.

  22. Give the error-function solution of Fick's second law for a semi-infinite solid with constant surface concentration (e.g. carburizing).

    $$\frac{C_x - C_0}{C_s - C_0} = 1 - \operatorname{erf}\left(\frac{x}{2\sqrt{D t}}\right)$$ where $C_0$ is the initial concentration, $C_s$ the constant surface concentration, and $C_x$ the concentration at depth $x$ after time $t$.

  23. What is the physical meaning of the diffusion length $\sqrt{Dt}$?

    $\sqrt{Dt}$ is the characteristic distance over which significant diffusion occurs in time $t$; the depth of a diffusion profile scales as $x \propto \sqrt{Dt}$, so to keep the same penetration the product $Dt$ must be held constant.

  24. Compare interstitial and substitutional (vacancy) diffusion mechanisms and their relative rates.

    Interstitial diffusion proceeds by small atoms (e.g. C, N, H) jumping between interstitial sites and is fast, with low activation energy. Substitutional diffusion requires an adjacent vacancy for an atom to jump into (vacancy mechanism) and is much slower, with higher activation energy.

What this deck covers

The Physical Metallurgy deck follows the GATE Metallurgical Engineering Physical Metallurgy syllabus — 10 chapters and 58 topics — so questions land on material that is genuinely examinable rather than trivia around it. That works out to roughly 5.6 cards per chapter.

Answers are written to be recallable, not just readable — averaging about 258 characters, which is long enough to carry the reasoning and short enough to say out loud.

A deck like this earns its keep on the second and third pass. Read the syllabus first so you know the shape of the subject, then use the cards to find the specific facts that have not stuck.

Physical Metallurgy flashcards FAQ

How many Physical Metallurgy flashcards are in this GATE Metallurgical Engineering deck?

56 cards. This page previews 24 of them, sampled evenly across the deck so you can judge the difficulty before installing anything.

Are these GATE Metallurgical Engineering flashcards free?

Yes. The preview here is free to read with no signup, and the full 56-card deck is free inside the Examius app.

What do the Physical Metallurgy cards cover?

They follow the GATE Metallurgical Engineering Physical Metallurgy syllabus — 10 chapters and 58 topics — so the questions track what is actually examinable.

How should I use these flashcards?

Read the syllabus first so you know the shape of the subject, then drill the deck. Examius schedules each card with spaced repetition, so cards you keep missing come back sooner and ones you know drift further apart.